Bread Board Medium Soldrless

The 400 Tie-Point Solderless Breadboard is a compact, half-size breadboard ideal for small electronic projects. It features 2 power rails, 30 columns, and 10 rows, providing a total of 400 connection points. The pins are spaced at a standard 0.1" apart, and the board is designed with a 0.3" gap between the two sets of five rows, making it easy to place a DIP (Dual In-line Package) component across them. The board supports wire sizes between 29-20 AWG and includes a self-adhesive backing for secure mounting. Additionally, the breadboard comes with interlocking parts, allowing it to be connected to other boards.

Product Features:

• Type: Plug-in breadboard
• Size: 3.3 x 0.3 inches (83.5 x 54.5 x 8.5mm)
• Total Tie Points: 400
• Power Rails: 2
• Pin Spacing: 0.1 inch
• Rows and Columns: 10 rows, 30 columns

Package Includes:

• 1 x 400 Tie-Points Solderless Breadboard

This breadboard is excellent for prototyping and experimenting with small circuit designs due to its compact size and convenient layout.